{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/330328849"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "Such processes are typically conducted under high vacuum, e.g., less than 0.01 torr and in the absence of minimal target material impurities, sputtered ions or other materials or processes which contribute to the dynamic masking process." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.de" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/235674161"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/330328849" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/332283556"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/330328849"] } } }
