{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/331929586"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "97383 Jun 20044 Nov 2004Dinesh ChopraMethod of providing a structure using self-aligned featuresUS2005002369731 Ago 20043 Feb 2005Micron Technology, Inc.Methods for making integrated-circuit wiring from copper, silver, gold, and other metals* Citada por examinador Citada por Patente citante Fecha de presentaci???n Fecha de publicaci???n Solicitante T???tuloUS7879715 *8 Oct 20071 Feb 2011Unitive In" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.es" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/90623868"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/331929586"] } } }
