{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/358976335"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "Embodiments of pass-through 3D interconnects may be employed in a variety of systems, including systems having a single die (e.g., positioned between two interposer substrates) or stacked systems of two or more levels of microelectronic dies." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/446103882"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/358976335"] } } }
