{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/383877740"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "When the semiconductor device is scaled down, the size of the via hole is smaller, e.g. 0.5 ??m, and the requirements for vertical alignment between the via hole and the first metallic wiring are more stringent." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/215990380"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/383877740"] } } }
