{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/386176877"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "d resin film, and electrically connecting thesource electrode and the organic semiconductor by disposing the second resin film having the source electrode embedded therein on the first resin film.A twenty-third aspect of the present invention is a method for manufacturing a semiconductor device according to the twenty-first or twenty-second aspect, comprising steps of embedding the drain electrode" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "patentgenius.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/137300572"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/386176877"] } } }
