{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/47433498"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "Next, a conductive layer 400 comprising bit line material, for example Al, Cu, alloys of Al and Cu, W, Ta, Ti, N or other materials or a combination of materials are formed on the structure illustrated in FIG. 3, resulting in the structure illustrated in FIG. 4." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.ca" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/472276704"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/47433498" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/472452491"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/47433498" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/140447272"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/47433498"] } } }
