{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/48191326"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "ansferring the circuit pattern onto the wafer having undergone the resist processing step using the above-mentioned exposure apparatus, a development step of developing the wafer exposed in the exposure step, an etching step of etching a portion except for the resist image developed in the development step, and a resist removal step of removing an unnecessary resist after etching." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.ca" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/222087794"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/48191326"] } } }
