{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/49738958"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "20090026083CONTINUOUS COPPER ELECTROPLATING METHOD - A continuous copper electroplating method wherein copper is continuously plated on a workpiece to be placed in a plating vessel accommodating a copper sulfate plating bath containing organic additives by use of a soluble or insoluble anode and a workpiece as a cathode, the method including overflowing the plating bath from the plating vessel in" ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "faqs.org" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/309619981"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/49738958"] } } }
