{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/67045789"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "Titanium nitride barrier layers deposited with a traditional CVD process further endure the severe problem of the conductive contact material (e.g., Cu, W, or Al) diffusing through the barrier layer and into neighboring materials, such as dielectric materials." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.de" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/61168487"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/67045789"] } } }
