{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/73609833"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "As shown in FIG. 37E, an encapsulation layer 5156, such as a layer of BCB or solder mask or other encapsulating material, is preferably formed over integrated circuits 5152, electrical circuits 5120, substrate 5102 and underfill material 5154." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.com" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/459616699"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/73609833"] } } }
