{ "items" : [
    { "id" : "http://webisa.webdatacommons.org/86558043"
      "properties" : {
        "http://www.w3.org/1999/02/22-rdf-syntax-ns#type" : [ "http://www.w3.org/ns/prov#Entity" ] ,
        "http://www.w3.org/ns/prov#value" : [ "Metal bumps can be formed of a conductor such as solder, gold, aluminum, indium or ITO (indium-tin oxide); indium which can be fused at comparatively low temperature is used with particular preference." ] ,
        "http://www.w3.org/ns/prov#wasQuotedFrom" : [ "google.es" ] } },

    { "id" : "http://webisa.webdatacommons.org/prov/288097590"
      "properties" : {
        "http://www.w3.org/ns/prov#wasDerivedFrom" : [ "http://webisa.webdatacommons.org/86558043"] } } }
