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121488 Ago 200525 Dic 2007Applied Materials, Inc.Copper barrier reflow process employing high speed optical annealingUS731216217 May 200525 Dic 2007Applied Materials, Inc.Low temperature plasma deposition process for carbon layer depositionUS732073422 Ago 200322 Ene 2008Applied Materials, Inc.Plasma immersion ion implantation system including a plasma source having low dissociation and low minimum
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