<http://webisa.webdatacommons.org/179261036>	<http://www.w3.org/ns/prov#value>	"The present invention is a method, apparatus and process for an improved substrate mounting and processing technique for various substrate treatments comprising cleaning, dicing, sawing, polishing, and planarization, among others." .
<http://webisa.webdatacommons.org/179261036>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/137300572>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/179261036> .
<http://webisa.webdatacommons.org/179261036>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .