<http://webisa.webdatacommons.org/prov/318226710>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/19941775> .
<http://webisa.webdatacommons.org/19941775>	<http://www.w3.org/ns/prov#value>	"In summary, the present invention is an apparatus and method that quickly and efficiently removes a circuit package from a module without causing damage to either." .
<http://webisa.webdatacommons.org/prov/351502363>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/19941775> .
<http://webisa.webdatacommons.org/19941775>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/266552304>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/19941775> .
<http://webisa.webdatacommons.org/prov/137300572>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/19941775> .
<http://webisa.webdatacommons.org/19941775>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .