<http://webisa.webdatacommons.org/217664284>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .
<http://webisa.webdatacommons.org/217664284>	<http://www.w3.org/ns/prov#value>	"A semiconductor device according to claim 14, wherein said package film has two bending portions and two external-connection film portions, in such a manner as to respectively correspond to two opposing sides of said semiconductor chip. 16." .
<http://webisa.webdatacommons.org/prov/301266400>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/217664284> .
<http://webisa.webdatacommons.org/217664284>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .