<http://webisa.webdatacommons.org/prov/186448185>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/275538788> .
<http://webisa.webdatacommons.org/275538788>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<docstoc.com> .
<http://webisa.webdatacommons.org/275538788>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/275538788>	<http://www.w3.org/ns/prov#value>	"atmosphere. A third external paste could be employed to form a pin pad external metallization layer 70 or 72 on surface 52 or 51, or to form electrical or electronic components such as resistors, capacitors or inductors on external metallization layer" .