<http://webisa.webdatacommons.org/336079032>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/336079032>	<http://www.w3.org/ns/prov#value>	"FIG. 3 is a plan view showing the bottom surface of the resin-encapsulated semiconductor device employing the lead frame of this embodiment." .
<http://webisa.webdatacommons.org/prov/249871565>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/336079032> .
<http://webisa.webdatacommons.org/336079032>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .