<http://webisa.webdatacommons.org/345614717>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/345614717>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/345614717>	<http://www.w3.org/ns/prov#value>	"A construction of a multilayer printed wiring board 10 manufactured using a solder ball loading method according to the first example of the present invention is described with reference to FIGS. 16 and 17." .
<http://webisa.webdatacommons.org/prov/351430220>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/345614717> .