<http://webisa.webdatacommons.org/prov/4192032>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/353419191> .
<http://webisa.webdatacommons.org/353419191>	<http://www.w3.org/ns/prov#value>	"As will be evident from the above discussion, the aforementioned coating formulations, polymers, and methods of the present invention can be advantageously employed in the production of electronic chips by providing a method for readily forming holes, vias, or other openings in a photopolymerized packaging layer for receiving conductive elements, such as solder balls." .
<http://webisa.webdatacommons.org/353419191>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/353419191>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .