<http://webisa.webdatacommons.org/38914665>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .
<http://webisa.webdatacommons.org/prov/94645448>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/38914665> .
<http://webisa.webdatacommons.org/38914665>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/38914665>	<http://www.w3.org/ns/prov#value>	"Thus, there is a drive to establish a method and apparatus to reliably fill vias since filled vias provide numerous advantages in the developing HDI (High Density Interconnect) and SBU (Sequential Build-Up) technologies." .