<http://webisa.webdatacommons.org/prov/226294731>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/429612326> .
<http://webisa.webdatacommons.org/429612326>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com.au> .
<http://webisa.webdatacommons.org/429612326>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/429612326>	<http://www.w3.org/ns/prov#value>	"FIG. 29 b depicts a light emitting surface mount chip package including array of chips, heat sink and protective dome, lens or cover according to the chip and surface mount configuration of FIG. 26 a above." .