<http://webisa.webdatacommons.org/51128257>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.fr> .
<http://webisa.webdatacommons.org/51128257>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/51128257>	<http://www.w3.org/ns/prov#value>	"The present invention relates to an electronic-circuit assembly and the manufacturing method thereof, particularly, to an electronic-circuit assembly and the manufacturing method thereof including a substrate upon which an electronic device is provided and other substrate which the former substrate is mounted." .
<http://webisa.webdatacommons.org/prov/425210260>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/51128257> .