<http://webisa.webdatacommons.org/52995427>	<http://www.w3.org/ns/prov#value>	"Thereafter, a conductive film such as a titanium film, a titanium nitride film or the like is formed to fill in the contact hole 10 and to cover the upper face of the interlayer insulating film 9 by the CVD method or a sputtering method." .
<http://webisa.webdatacommons.org/52995427>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/52995427>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/380878537>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/52995427> .