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<http://webisa.webdatacommons.org/8708661>	<http://www.w3.org/ns/prov#value>	"A method for in situ plasma bonding of wafers for silicon, gallium arsenide, indium phosphide, or other materials where a direct contact without an interface is desired, comprising the steps of:" .
<http://webisa.webdatacommons.org/prov/60235804>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/8708661> .
<http://webisa.webdatacommons.org/8708661>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/411875445>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/8708661> .