<http://webisa.webdatacommons.org/100358085>	<http://www.w3.org/ns/prov#value>	"FIELD OFTHE INVENTIONThe present invention relates generally to manufacturing semiconductor devices, particularly highly miniaturized semiconductor devices having ultra-shallow junction depths." .
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<http://webisa.webdatacommons.org/prov/396589647>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/100358085> .