<http://webisa.webdatacommons.org/250579126>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/250579126>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<freepatentsonline.com> .
<http://webisa.webdatacommons.org/250579126>	<http://www.w3.org/ns/prov#value>	"Accordingly, printed circuit board 25 may comprise thermally conductive materials including metals, such as aluminum, copper, silicon and alloys thereof." .
<http://webisa.webdatacommons.org/prov/292035026>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/250579126> .