<http://webisa.webdatacommons.org/prov/396589647>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/51243611> .
<http://webisa.webdatacommons.org/51243611>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/51243611>	<http://www.w3.org/ns/prov#value>	"TECHNICAL FIELDThe present invention relates generally to semiconductor devices and manufacturing methods and more particularly to a semiconductor device having a low stress coating and a method of forming thereof.BACKGROUNDPolyimide films are frequently used as a protective overcoat for semiconductor devices." .
<http://webisa.webdatacommons.org/prov/385267100>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/51243611> .
<http://webisa.webdatacommons.org/51243611>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<patentgenius.com> .