<http://webisa.webdatacommons.org/58987065>	<http://www.w3.org/ns/prov#value>	"More particularly, the present invention relates to microelectronic devices including interconnect structures and to methods for forming the interconnect structures." .
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<http://webisa.webdatacommons.org/58987065>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/132304561>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/58987065> .