About: isa:10361529   Sponge Permalink

An Entity of Type : prov:Entity, within Data Space : webisa.webdatacommons.org associated with source dataset(s)

AttributesValues
rdf:type
prov:value
  • ving leads reached by vias through passivation covering access planeUS5751031Apr 28, 1997May 12, 1998Micron Technology, Inc.Memory and other integrated circuitry having a conductive interconnect line pitch of less than 0.6 micronUS5904556Jan 11, 1996May 18, 1999Hitachi, Ltd.Method for making semiconductor integrated circuit device having interconnection structure using tungsten filmUS6078100 *Jan
prov:wasQuotedFrom
is prov:wasDerivedFrom of
Alternative Linked Data Views: ODE     Raw Data in: CXML | CSV | RDF ( N-Triples N3/Turtle JSON XML ) | OData ( Atom JSON ) | Microdata ( JSON HTML) | JSON-LD    About   
This material is Open Knowledge   W3C Semantic Web Technology [RDF Data] Valid XHTML + RDFa
OpenLink Virtuoso version 07.20.3217, on Linux (x86_64-pc-linux-gnu), Standard Edition
Data on this page belongs to its respective rights holders.
Virtuoso Faceted Browser Copyright © 2009-2012 OpenLink Software