| prov:value
| - As the solder for connection to the heat sink 3, forming the second-component connecting layer 21, there are suitably used a solder composed of at least one metal selected from the group consisting of In, Sn, Ag, Au, Ge, Si, Cu, Al, Bi, Sb and Zn and particularly at least one metal selected from the group consisting of In, Sn, Ag, Ge, Si, Cu, Al, Bi, Sb and Zn, having a melting point of less than
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