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  • However, with this method, there is a limitation in achieving desired tolerance to ESD. As another method, a light emitting diode (which will be referred to hereinafter as ???LED???) of flip-chip structure is connected in parallel to a Si-based Zener diode so as to protect the light emitting device from ESD. However, in this method, an additional Zener diode must be purchased, and then assembled t
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