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  • olutions, planarizing machines and methods for mechanical or chemical-mechanical planarization of microelectronic-device substrate assembliesUS6407000Apr 9, 1999Jun 18, 2002Micron Technology, Inc.MicroelectronicsUS6440185 *Jan 8, 2001Aug 27, 2002Noritake Co., Ltd.Abrasive grains and filler including hollow organic material dispersed in a bond made by curing liquid resin such as epoxy resin; low gr
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