Following placement of the devices 50A, 50B back-to-back between the plates 112, 114, compressive forces 46 are exerted upon surfaces 142 144 to clamp the plates 112, 114 against the pair of substrates 18A, 18B and the process proceeds to attach, such as by using adhesive bonding, the covers 130 to the substrate 18A, 18B. The lower edge of each cover 130 may be coated with a suitable adhesive to a