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  • or making integrated-circuit wiring from copper, silver, gold, and other metalsUS6768202 *Jul 3, 2002Jul 27, 2004Kabushiki Kaisha ToshibaSemiconductor device and method of manufacturing the sameUS6794283 *May 27, 1999Sep 21, 2004Sanyo Electric Co., Ltd.Semiconductor device and fabrication method thereofUS6806572Oct 22, 2002Oct 19, 2004Micron Technology, Inc.Structure for contact formation using a
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