Note that the depth of the interconnection use grooves M is for example about 800 nm. [0127] Next, as shown in FIG. 1C, a barrier film 103 is formed on the surface of the interlayer insulation film 102 and in the contact holes CH and the interconnection grooves M. This barrier film 103 is formed by a material such as Ta, Ti, W, Co, Si, Ni, an alloy of compounds of these metals with nitrogen or pho