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  • For example, it is formed so as to accelerate the growth of metal grains when burying the interconnection grooves and the contact holes with a metal. [0130] Next, as shown in FIG. 2E, an interconnection layer 105 made of Al, W, WN, Cu, Au, or Ag, or an alloy film of these metals, is formed on the barrier film 103 to a thickness of for example about 1600 nm so as to bury the contact holes CH and th
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