About: isa:116608334   Sponge Permalink

An Entity of Type : prov:Entity, within Data Space : webisa.webdatacommons.org associated with source dataset(s)

AttributesValues
rdf:type
prov:value
  • The gap between the chip and the support and the space between the solder joints is usually filled with plastic underfill material 15 in order to mitigate thermomechanical stress and reduce reliability risks on the solder joints. [0035] Support 14 consists of electrically insulating material such as polyimide, but conductive routing strips (not shown in FIG. 1) are integral with support 14.
prov:wasQuotedFrom
is prov:wasDerivedFrom of
Alternative Linked Data Views: ODE     Raw Data in: CXML | CSV | RDF ( N-Triples N3/Turtle JSON XML ) | OData ( Atom JSON ) | Microdata ( JSON HTML) | JSON-LD    About   
This material is Open Knowledge   W3C Semantic Web Technology [RDF Data] Valid XHTML + RDFa
OpenLink Virtuoso version 07.20.3217, on Linux (x86_64-pc-linux-gnu), Standard Edition
Data on this page belongs to its respective rights holders.
Virtuoso Faceted Browser Copyright © 2009-2012 OpenLink Software