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  • The reference numeral 5 designates a heat radiation block which is stuck on the die pad 3 with an adhesive agent such as epoxy resin, and the reference numeral 6 designates a semiconductor element which is stuck on the die pad 3 with an adhesive agent such as epoxy resin so that the semiconductor element 6 and the heat radiation block 5 are disposed on the opposite sides of the die pad 3.
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