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An Entity of Type : prov:Entity, within Data Space : webisa.webdatacommons.org associated with source dataset(s)

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  • The heat sink can therefore be moved to a position (e.g., in full contact with a circuit board component package, into contact with thermal transfer material that contacts the circuit board component package, etc.) that allows the heat sink to transfer heat from the circuit board component to another structure, such as the support assembly.
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