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An Entity of Type : prov:Entity, within Data Space : webisa.webdatacommons.org associated with source dataset(s)

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  • Insulation material, such as Sio2, SiOx, SiN, FSG, BPSG, BSG, low-k material, or other suitable dielectric material is deposited over exposed portions of preprocessed wafer 220, bottom contact 232, dielectric material layer 210b, and storage location 204.
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