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  • particle such as copper, an epoxy resin containing a hydroxyl group, an amino group and carboxyl group not more than 5 mol % and epoxy equivalent of epoxy compounds ranges 100-350 g/eq.US20020094604 *20 Feb 200218 Jul 2002Masaaki HayamaMethod for fabricating a multilayer ceramic substrateUS20040043596 *25 Ago 20034 Mar 2004Kabushiki Kaisha ToshibaPaste including a mixture of powders, connection p
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