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  • proved line width accuracyUS6489247 *8 Sep 19993 Dec 2002Applied Materials, Inc.Copper etch using HCl and HBR chemistryUS6541380 *24 Jul 20011 Apr 2003Applied Materials Inc.Plasma etching process for metals and metal oxides, including metals and metal oxides inert to oxidationUS6620733 *12 Feb 200116 Sep 2003Lam Research CorporationUse of hydrocarbon addition for the elimination of micromasking du
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