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  • Moreover, if desired, a precious metal or other non-corrosive metal coating or plating, may be selectively deposited, e.g. by electroplating, over the copper plating aforementioned circuit pattern of the connector member and preferably on the contact faces of the pin connectable means, as well as on the terminals of the connector member which connect to the I/O pads, i.e. contacts, of the board.
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