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  • including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devicesUS713274429 Oct 20017 Nov 2006Broadcom CorporationEnhanced die-up ball grid array packages and method for making the sameUS7161239 *31 Oct 20029 Jan 2007Broadcom CorporationBall grid array package enhanced with a thermal an
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