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  • itives for low dielectric filmsUS8153833Mar 22, 2011Apr 10, 2012Advanced Technology Materials, Inc.Composition and method for low temperature deposition of silicon-containing films such as films including silicon, silicon nitride, silicon dioxide and/or silicon-oxynitrideUS8173537Mar 29, 2007May 8, 2012Novellus Systems, Inc.Methods for reducing UV and dielectric diffusion barrier interactionUS8211
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