| prov:value
| - The insulating film is formed to have the single-layer structure or the stacked-layer structure using an inorganic material such as silicon oxide or silicon nitride, an organic material such as polyimide, polyamide, benzocyclobutene, acryl, or epoxy, a siloxane material, or the like by CVD, sputtering, SOG, a droplet discharge method, a screen printing method, or the like.
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