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  • On the valve chip 131, all fixed electrodes may be electrically connected to a first input pad (such as a first gold bond pad), and all flexible electrodes may be electrically connected to a second input pad (such as a second gold bond pad), and the input pads may be electrically connected (e.g., via wire bonding such as gold wire bonding, solder bumping, conductive epoxy, or other means known to
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