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  • ng the wafer from the process chamber to the load lock chamber in the processing system shown in FIG. 1. [0022]FIG. 4 is a flowchart as a variation of FIG. 3. [0023]FIG. 5 is an EUV optical system as a variation of the exposure apparatus shown in FIG. 1. [0024]FIG. 6 is a flowchart for explaining a fabrication of devices (i.e., semiconductor chips such as IC and LSI, LCDs CCDs, etc.). [0025]FIG. 7
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