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  • nMethod for making electronic devices including silicon and LTCC and devices produced therebyUS6818973Sep 9, 2002Nov 16, 2004Amkor Technology, Inc.Integrated circuit chip package, creating exposed leads in a cost-effective manner.US6879034May 1, 2003Apr 12, 2005Amkor Technology, Inc.Semiconductor package including low temperature co-fired ceramic substrateUS6919620Sep 17, 2002Jul 19, 2005Amkor Tec
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