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  • BN, SiC, GaAs, Si, and C (diamond) are used preferably as the material for the submount other than AlN. It is possible to use other materials such as, a semiconductor substrate made of a semiconductor such as GaAs, GaP, InP, ZnSe, ZnS, ZnO, a single metal substrate, or a metal substrate made of a metal complex including at least two metals which do not form a solid solution or have small solid sol
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